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公开(公告)号:US20230391015A1
公开(公告)日:2023-12-07
申请号:US18449027
申请日:2023-08-14
Applicant: HONEYWELL INTERNATIONAL INC.
Inventor: John Bowler , Gregory Colvin , Suresh Sundarraj
IPC: B29C64/393 , B29C64/245 , B29C64/273
CPC classification number: B29C64/393 , B29C64/245 , B29C64/273
Abstract: Systems and methods resolve stresses in additive manufacturing. A stress resolution profile including frequency and amplitude parameters of an ultrasonic input are determined based on physical properties of the product. Successive layers of a material are added and energy is applied to incorporate the material of each layer into the product. An ultrasonic input is applied with the determined parameters to resolve stress as the product is built up. The ultrasonic input is varied as a depth of the material incorporated into the product increases.
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公开(公告)号:US10927995B2
公开(公告)日:2021-02-23
申请号:US16181831
申请日:2018-11-06
Applicant: HONEYWELL INTERNATIONAL INC.
Inventor: John Bowler
IPC: F16L55/18 , B23P6/00 , F16L55/162
Abstract: Methods and apparatus are provided for repairing a damaged area within a cored passage of a component. The method includes providing a repair tool that has a support portion, a leading portion extending from a first end of the support portion, and a trailing portion extending from a second end of the support portion. The leading portion of the repair tool is inserted into a first opening of the cored passage, and is threaded through the cored passage until the support portion is positioned at the damaged area within the cored passage. A restoration activity is performed on the damaged area as the support portion supports the cored passage proximate to the damaged area. Upon completion of the restoration activity, the repair tool is removed from the cored passage.
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公开(公告)号:US20210354396A1
公开(公告)日:2021-11-18
申请号:US16872618
申请日:2020-05-12
Applicant: HONEYWELL INTERNATIONAL INC.
Inventor: John Bowler , Gregory Colvin , Suresh Sundarraj
IPC: B29C64/393 , B29C64/273 , B29C64/245
Abstract: Systems and methods resolve stresses in additive manufacturing. A stress resolution profile including frequency and amplitude parameters of an ultrasonic input are determined based on physical properties of the product. Successive layers of a material are added and energy is applied to incorporate the material of each layer into the product. An ultrasonic input is applied with the determined parameters to resolve stress as the product is built up. The ultrasonic input is varied as a depth of the material incorporated into the product increases.
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公开(公告)号:US20240343410A1
公开(公告)日:2024-10-17
申请号:US18299881
申请日:2023-04-13
Applicant: HONEYWELL INTERNATIONAL INC.
Inventor: John Bowler
Abstract: A method and system for emergency landing routing and prioritization for an vertical takeoff and landing (VTOL) aircraft has been developed. First, an emergency condition onboard the VTOL aircraft is detected that requires a landing. The emergency condition onboard the aircraft is then categorized based on severity. All potential landing zones (LZs) for the VTOL aircraft are identified and categorized based on suitability for landing. The LZs for the VTOL aircraft are prioritized based on the severity of the emergency condition onboard the aircraft in view of the suitability of the LZs. Finally, a priority listing of the LZs displayed to an aircrew member of the VTOL aircraft.
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公开(公告)号:US11772330B2
公开(公告)日:2023-10-03
申请号:US16872618
申请日:2020-05-12
Applicant: HONEYWELL INTERNATIONAL INC.
Inventor: John Bowler , Gregory Colvin , Suresh Sundarraj
IPC: B29C64/393 , B29C64/245 , B29C64/273
CPC classification number: B29C64/393 , B29C64/245 , B29C64/273
Abstract: Prior to manufacturing a product by additive manufacturing, a stress relief profile including frequency and amplitude parameters of an ultrasonic input is determined based on physical properties of the product, including resonant frequencies of the product and a material from which the product is manufactured. Successive layers of a material are added and energy is applied to incorporate the material of each layer into the product. A processor accesses stress relief profile parameters for each layer, determines whether a layer requires stress relief and determines a frequency and a power level for the stress relief at the layer. An ultrasonic input is applied with the determined parameters to relieve stress as the product is built up.
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