STANDOFF FOR CIRCUIT BOARD HAVING TEMPERATURE-VARIABLE ELECTRICAL ELEMENT

    公开(公告)号:US20210282259A1

    公开(公告)日:2021-09-09

    申请号:US16860965

    申请日:2020-04-28

    Abstract: A temperature-variable standoff includes a temperature-variable electrical element. The standoff also includes a support body that supports the temperature-variable electrical element and that is configured to support a circuit board separated at a distance from another component of an electronics assembly. The support body is configured to attach to the circuit board and to project away from the circuit board with a first end proximate the circuit board and a second end spaced away from the circuit board. The standoff further includes an electrical connector supported proximate the first end. The electrical connector is configured to electrically connect within an electrical circuit of the circuit board to provide the electrical input to the temperature-variable electrical element for selectively varying the temperature thereof.

    Standoff for circuit board having temperature-variable electrical element

    公开(公告)号:US11324110B2

    公开(公告)日:2022-05-03

    申请号:US16860965

    申请日:2020-04-28

    Abstract: A temperature-variable standoff includes a temperature-variable electrical element. The standoff also includes a support body that supports the temperature-variable electrical element and that is configured to support a circuit board separated at a distance from another component of an electronics assembly. The support body is configured to attach to the circuit board and to project away from the circuit board with a first end proximate the circuit board and a second end spaced away from the circuit board. The standoff further includes an electrical connector supported proximate the first end. The electrical connector is configured to electrically connect within an electrical circuit of the circuit board to provide the electrical input to the temperature-variable electrical element for selectively varying the temperature thereof.

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