公开(公告)号：US10178800B2

公开(公告)日：2019-01-08

申请号：US15474486

申请日：2017-03-30

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Saravana Mahalingam ,  Abhay Naik ,  Yathiraj Kasal ,  Rakesh Hota ,  Rajendra Prasad Vrukshavai ,  Mathews Leslie Kuriakose ,  Ravi Anekal Radhakrishnan

IPC: H05K7/20 ,  H05K7/14

Abstract: A support structure for an electronic component a chassis and a standoff that is attached to the chassis. The standoff is configured to support the electronic component and separate the electronic component at a distance away from the chassis. The standoff is configured to receive heat generated by the electronic component. The standoff includes a fluid passageway. The fluid passageway is configured to allow a cooling fluid to flow therethrough for convective heat transfer from the standoff to the cooling fluid.

公开(公告)号：US11324110B2

公开(公告)日：2022-05-03

申请号：US16860965

申请日：2020-04-28

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： NSV Sarveswara Sarma A ,  Saravanakumar Mahalingam ,  Rama Kumar Mayil ,  Ravi Anekal Radhakrishnan

IPC: H05K1/02 ,  H05K7/14

Abstract: A temperature-variable standoff includes a temperature-variable electrical element. The standoff also includes a support body that supports the temperature-variable electrical element and that is configured to support a circuit board separated at a distance from another component of an electronics assembly. The support body is configured to attach to the circuit board and to project away from the circuit board with a first end proximate the circuit board and a second end spaced away from the circuit board. The standoff further includes an electrical connector supported proximate the first end. The electrical connector is configured to electrically connect within an electrical circuit of the circuit board to provide the electrical input to the temperature-variable electrical element for selectively varying the temperature thereof.

公开(公告)号：US20210282259A1

公开(公告)日：2021-09-09

申请号：US16860965

申请日：2020-04-28

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： NSV Sarveswara Sarma A ,  Saravanakumar Mahalingam ,  Rama Kumar Mayil ,  Ravi Anekal Radhakrishnan

IPC: H05K1/02

Abstract: A temperature-variable standoff includes a temperature-variable electrical element. The standoff also includes a support body that supports the temperature-variable electrical element and that is configured to support a circuit board separated at a distance from another component of an electronics assembly. The support body is configured to attach to the circuit board and to project away from the circuit board with a first end proximate the circuit board and a second end spaced away from the circuit board. The standoff further includes an electrical connector supported proximate the first end. The electrical connector is configured to electrically connect within an electrical circuit of the circuit board to provide the electrical input to the temperature-variable electrical element for selectively varying the temperature thereof.

公开(公告)号：US20180288900A1

公开(公告)日：2018-10-04

申请号：US15474486

申请日：2017-03-30

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Saravana Mahalingam ,  Abhay Naik ,  Yathiraj Kasal ,  Rakesh Hota ,  Rajendra Prasad Vrukshavai ,  Mathews Leslie Kuriakose ,  Ravi Anekal Radhakrishnan

IPC: H05K7/20 ,  H05K7/14

CPC classification number: H05K7/20263 ,  H05K7/1427 ,  H05K7/20272

Abstract: A support structure for an electronic component a chassis and a standoff that is attached to the chassis. The standoff is configured to support the electronic component and separate the electronic component at a distance away from the chassis. The standoff is configured to receive heat generated by the electronic component. The standoff includes a fluid passageway. The fluid passageway is configured to allow a cooling fluid to flow therethrough for convective heat transfer from the standoff to the cooling fluid.