HERMETIC SEALING OF ATOMIC SENSOR USING SOL-GEL TECHNIQUE
    1.
    发明申请
    HERMETIC SEALING OF ATOMIC SENSOR USING SOL-GEL TECHNIQUE 审中-公开
    使用SOL-GEL技术的原子传感器的密封

    公开(公告)号:US20140076602A1

    公开(公告)日:2014-03-20

    申请号:US13622074

    申请日:2012-09-18

    CPC classification number: G04F5/14

    Abstract: A method of forming a physics package for an atomic sensor comprises providing a plurality of panels, with each of the panels having multiple edges, and assembling the panels in a three-dimensional multi-faced geometric configuration such that the edges of adjacent panels are aligned with each other. A sol-gel material is applied to the edges of the panels, and the sol-gel material is cured to hermetically seal adjacent panels together.

    Abstract translation: 形成用于原子传感器的物理封装的方法包括提供多个面板,每个面板具有多个边缘,并且将面板组装成三维多面几何构型,使得相邻面板的边缘对准 与彼此。 将溶胶凝胶材料施加到面板的边缘,并且固化溶胶 - 凝胶材料以将相邻的面板密封在一起。

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