公开(公告)号：US20240306291A1

公开(公告)日：2024-09-12

申请号：US18180871

申请日：2023-03-09

申请人： HTC Corporation

发明人： Che-Jung Chang ,  Chia-Chu Ho ,  Huan Yi Chu

IPC分类号： H05K1/02

CPC分类号： H05K1/0298

摘要： A circuit board and a layout method thereof are provided. The circuit board includes a first metal layer, a second metal layer, and a third metal layer. The first metal layer forms multiple first reference conductive wires. The second metal layer forms at least one signal transmission wire. The third metal layer forms multiple third reference conductive wires. The first metal layer, the second metal layer, and a third metal layer are overlapped with each other, and each of the first reference conductive wires is not completely overlapped with each of the second reference conductive wires.