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公开(公告)号:US20230402793A1
公开(公告)日:2023-12-14
申请号:US17805865
申请日:2022-06-08
申请人: HTC Corporation
发明人: Shih-Nien HUANG
IPC分类号: H01R13/6466 , H01R13/66
CPC分类号: H01R13/6466 , H01R13/6658
摘要: An electronic device includes a printed circuit board, an integrated circuit, a connector, a choke module and a compensation module. The integrated circuit is disposed on the printed circuit board. The connector is disposed on the printed circuit board. The choke module is disposed on the printed circuit board and coupled between the integrated circuit and the connector. The compensation module is disposed on the printed circuit board and coupled between the choke module and the connector.