公开(公告)号：US20250130616A1

公开(公告)日：2025-04-24

申请号：US19002430

申请日：2024-12-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Weiqiang Xu ,  Biao Wu ,  Si Sun ,  Hui Lin ,  Zhiquan Liu

IPC: G06F1/20 ,  H05K7/20

Abstract: A computer system and a server are provided, to improve heat dissipation of the computer system and improve deployment space utilization of processors. The computer system includes a heat dissipation layer, a computing layer, and a high-speed layer. The computing layer includes a processor configured to generate an electrical signal. The heat dissipation layer includes a heat dissipation structure, the heat dissipation structure is coupled to the processor, and the heat dissipation structure is configured to dissipate heat for the processor. The high-speed layer includes a cable module configured to transmit the electrical signal, and the cable module is coupled to the processor.