公开(公告)号：US11432432B2

公开(公告)日：2022-08-30

申请号：US16663567

申请日：2019-10-25

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Ying Dong ,  Weifeng Hu ,  Binghua Li ,  Jibin Zhou

IPC: H05K7/20

Abstract: A heat dissipation apparatus is provided, an electronic component is disposed on one side of an adjustable heat dissipation component, and a rotating shaft is disposed on another side of the adjustable heat dissipation component; and one end of a connecting component is connected to the adjustable heat dissipation component, another end of the connecting component is connected to a fixed substrate, and the connecting component drives the adjustable heat dissipation component to rotate by using the rotating shaft. The connecting component may be adjusted to rotate the electronic component together with the adjustable heat dissipation component, to reduce complexity in deploying the electronic component and the heat dissipation apparatus without affecting a heat dissipation effect, thereby improving convenience of operation.