公开(公告)号：US20240236544A9

公开(公告)日：2024-07-11

申请号：US18547875

申请日：2022-02-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chengjie Shen ,  Dexin Xu ,  Yinhu Zhu ,  Xun Zhang

IPC: H04R1/10

CPC classification number: H04R1/1041 ,  H04R1/1008 ,  H04R1/1016 ,  H04R1/105 ,  H04R1/1058

Abstract: This application discloses a headset, where the headset includes an ear housing and an earbud fastened to the ear housing, the earbud includes an earbud body and an SMA component embedded in the earbud body, and the earbud can automatically adjust a shape to adapt to a wearing environment. This application further discloses another headset, where the headset includes a headband and earmuffs connected to the headband, the earmuff includes an ear housing, an earpad fastened to the ear housing, and an SMA component embedded in the earpad, and the earpad can automatically adjust a shape to adapt to a wearing environment. The headset has high wearing comfort. This application further discloses a headset assembly including the foregoing headset and a related method.

公开(公告)号：US20240137686A1

公开(公告)日：2024-04-25

申请号：US18547875

申请日：2022-02-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chengjie Shen ,  Dexin Xu ,  Yinhu Zhu ,  Xun Zhang

IPC: H04R1/10

CPC classification number: H04R1/1041 ,  H04R1/1008 ,  H04R1/1016 ,  H04R1/105 ,  H04R1/1058

Abstract: This application discloses a headset, where the headset includes an ear housing and an earbud fastened to the ear housing, the earbud includes an earbud body and an SMA component embedded in the earbud body, and the earbud can automatically adjust a shape to adapt to a wearing environment. This application further discloses another headset, where the headset includes a headband and earmuffs connected to the headband, the earmuff includes an ear housing, an earpad fastened to the ear housing, and an SMA component embedded in the earpad, and the earpad can automatically adjust a shape to adapt to a wearing environment. The headset has high wearing comfort. This application further discloses a headset assembly including the foregoing headset and a related method.