公开(公告)号：US20240324143A1

公开(公告)日：2024-09-26

申请号：US18679732

申请日：2024-05-31

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hui JIA ,  Xinye ZHANG ,  Chenxi FENG ,  Jie YANG

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20327 ,  H05K1/0203 ,  H05K7/20318 ,  H05K2201/064

Abstract: A liquid cooling structure is provided. The structure includes a liquid storage portion, a condenser, a liquid return channel and a liquid cooling portion having a liquid storage cavity configured to store a liquid state cooling medium. The liquid cooling portion includes a spraying member and a sealing member having a first sealed cavity configured to accommodate a to-be-cooled member, the spraying member communicates with the liquid storage cavity, and is configured to spray the cooling medium onto the to-be-cooled member. The condenser communicates with the first sealed cavity and the liquid storage cavity, and is configured to cool the gaseous state cooling medium to form the cooling medium in the liquid state. The liquid return channel communicates with the first sealed cavity and the liquid storage cavity, and is configured to transfer the liquid state cooling medium in the first sealed cavity to the liquid storage cavity.