公开(公告)号：US20200084913A1

公开(公告)日：2020-03-12

申请号：US16685019

申请日：2019-11-15

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hui JIA

IPC: H05K7/20 ,  F28F3/02

Abstract: Embodiments of this application relate to a heat dissipator including a cover plate, an orifice plate, and a base plate that are stacked in sequence. A distribution cavity is disposed between the orifice plate and the cover plate, a heat exchange cavity is disposed between the orifice plate and the base plate, and the distribution cavity communicates with the heat exchange cavity by using through holes disposed on the orifice plate. A plurality of pin fins facing the orifice plate are disposed on a surface of the base plate in the heat exchange cavity, gaps between the plurality of pin fins constitute a fluid passage, and the pin fins include a combination pin fin in contact with the orifice plate, and a flow guiding pin fin that corresponds to the through hole and that has a gap with the through hole.

公开(公告)号：US20240324143A1

公开(公告)日：2024-09-26

申请号：US18679732

申请日：2024-05-31

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hui JIA ,  Xinye ZHANG ,  Chenxi FENG ,  Jie YANG

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20327 ,  H05K1/0203 ,  H05K7/20318 ,  H05K2201/064

Abstract: A liquid cooling structure is provided. The structure includes a liquid storage portion, a condenser, a liquid return channel and a liquid cooling portion having a liquid storage cavity configured to store a liquid state cooling medium. The liquid cooling portion includes a spraying member and a sealing member having a first sealed cavity configured to accommodate a to-be-cooled member, the spraying member communicates with the liquid storage cavity, and is configured to spray the cooling medium onto the to-be-cooled member. The condenser communicates with the first sealed cavity and the liquid storage cavity, and is configured to cool the gaseous state cooling medium to form the cooling medium in the liquid state. The liquid return channel communicates with the first sealed cavity and the liquid storage cavity, and is configured to transfer the liquid state cooling medium in the first sealed cavity to the liquid storage cavity.

公开(公告)号：US20220225532A1

公开(公告)日：2022-07-14

申请号：US17708657

申请日：2022-03-30

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hui JIA

IPC: H05K7/20 ,  F28F3/02

Abstract: Embodiments of this application relate to a heat dissipator including a cover plate, an orifice plate, and a base plate that are stacked in sequence. A distribution cavity is disposed between the orifice plate and the cover plate, a heat exchange cavity is disposed between the orifice plate and the base plate, and the distribution cavity communicates with the heat exchange cavity by using through holes disposed on the orifice plate. A plurality of pin fins facing the orifice plate are disposed on a surface of the base plate in the heat exchange cavity, gaps between the plurality of pin fins constitute a fluid passage, and the pin fins include a combination pin fin in contact with the orifice plate, and a flow guiding pin fin that corresponds to the through hole and that has a gap with the through hole.

公开(公告)号：US20240196563A1

公开(公告)日：2024-06-13

申请号：US18585360

申请日：2024-02-23

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hui JIA ,  Guangjing WANG ,  Shanjiu CHI

IPC: H05K7/20

CPC classification number: H05K7/20263 ,  H05K7/20236 ,  H05K7/20272 ,  H05K7/20318 ,  H05K7/20627

Abstract: A liquid cooling node is provided, the node includes a sealed compartment, a cooling component, two first connectors, and two second connectors. The sealed compartment is filled with a first medium. The cooling component is disposed in the sealed compartment, and the cooling component is filled with a second medium. The first connectors are disposed on a side wall of the sealed compartment, and are communicated with the sealed compartment to form a first cooling path. The second connectors are disposed on the side wall of the sealed compartment, and are communicated with the cooling component to form a second cooling path. In this application, a heat dissipation problem of a single high-power main chip can be resolved, so that an entire data center node maintains a low temperature for a long time.

公开(公告)号：US20240389262A1

公开(公告)日：2024-11-21

申请号：US18785125

申请日：2024-07-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Dingfang LI ,  Hui JIA ,  Gaoliang XIA

IPC: H05K7/20

Abstract: A heat dissipation apparatus is provided. The apparatus includes: a cover plate, a flow distribution plate, and a heat dissipation member. A first flow inlet and outlet are disposed in the cover plate, a flow inlet cavity and a flow outlet cavity that are isolated from each other are disposed in the cover plate, the first flow inlet and outlet communicate with the flow inlet and outlet cavity respectively. The heat dissipation member includes a heat dissipation portion, where a heat dissipation flow channel is formed. A second flow inlet and second flow outlets are provided in the flow distribution plate, the second flow inlet communicates with the flow inlet cavity and the heat dissipation flow channel. The second flow outlets are respectively located at the two ends of the heat dissipation flow channel, and communicate with the heat dissipation flow channel and the flow outlet cavity.

公开(公告)号：US20230239995A1

公开(公告)日：2023-07-27

申请号：US18191946

申请日：2023-03-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hui JIA ,  Xinhu GONG ,  Dingfang LI

IPC: H05K1/02

CPC classification number: H05K1/021 ,  H05K1/0204

Abstract: A heat sink includes: a first heat dissipation module in thermal contact with the first heat source; a heat dissipation base in thermal contact with the second heat source, where the heat dissipation base is fixed on the circuit board, the first heat dissipation module is floatingly fixed on the heat dissipation base, and the heat dissipation base is provided with a first opening; and a second heat dissipation module, disposed between the first heat dissipation module and the heat dissipation base, where the second heat dissipation module is fixed on the heat dissipation base, the second heat dissipation module is provided with a second opening corresponding to the first opening, and the first heat dissipation module sequentially runs through the second opening and the first opening to be in thermal contact with the first heat source.