公开(公告)号：US20220304138A1

公开(公告)日：2022-09-22

申请号：US17837445

申请日：2022-06-10

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chenyang HE ,  Ruiming MO ,  Jie SUN

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

Abstract: An electronic element, a circuit board with an electronic element, and an electronic device are provided. The electronic element includes a substrate and a first input pad, at least one chip, and a first output pad that are disposed on a first surface of the substrate, where the first input pad, the at least one chip, and the first output pad are sequentially connected, the first input pad and the first output pad are directly disposed on the first surface of the substrate, and a surface of the first input pad facing away from the substrate and a surface of the first output pad facing away from the substrate constitute a partial area of an outer surface of the electronic element.