-
公开(公告)号：US20230300985A1
公开(公告)日：2023-09-21
申请号：US18325551
申请日：2023-05-30
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Jie SUN , Ruiming MO , Xichen YANG , Yi XU
CPC classification number: H05K1/144 , H05K1/0209 , H05K2201/042 , H05K2201/047 , H05K2201/10098 , H05K2201/10719
Abstract: Embodiments of this application disclose an electronic component and an electronic device, to achieve a three-dimensional stacked structure, reduce an area, and improve heat dissipation. In embodiments of this application, the electronic component includes an upper cover plate, a lower cover plate, and an enclosure frame. The upper cover plate carries a first circuit. The lower cover plate carries a second circuit. The enclosure frame is separately connected to the upper cover plate and the lower cover plate. An interconnection circuit is disposed in the enclosure frame, and the interconnection circuit is configured to implement interconnection between the first circuit and the second circuit. The first circuit and the second circuit overlap in a vertical direction without interfering with each other.
-
公开(公告)号：US20220304138A1
公开(公告)日：2022-09-22
申请号：US17837445
申请日：2022-06-10
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Chenyang HE , Ruiming MO , Jie SUN
Abstract: An electronic element, a circuit board with an electronic element, and an electronic device are provided. The electronic element includes a substrate and a first input pad, at least one chip, and a first output pad that are disposed on a first surface of the substrate, where the first input pad, the at least one chip, and the first output pad are sequentially connected, the first input pad and the first output pad are directly disposed on the first surface of the substrate, and a surface of the first input pad facing away from the substrate and a surface of the first output pad facing away from the substrate constitute a partial area of an outer surface of the electronic element.
-
Search Results
2
records
(took 0.012 seconds)
