公开(公告)号：US20210249747A1

公开(公告)日：2021-08-12

申请号：US17244741

申请日：2021-04-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Dajun ZANG ,  Cuicui WANG ,  Daochun MO ,  Yuchun LU ,  Linchun WANG

IPC: H01P5/10 ,  H01P3/08 ,  H04B3/54 ,  H03H7/42

Abstract: Embodiments of this application provide a balance-unbalance conversion apparatus. The apparatus includes an insulation substrate, a first microstrip, a second microstrip, and a conductive ground. The first microstrip includes a first balance signal connection section, a first impedance matching section, and an unbalance signal connecting section. The unbalance signal connecting section is configured to transmit an unbalance signal. The second microstrip includes a second balance signal connecting section, a second impedance matching section, and a ground section. The second balance signal connecting section is configured to transmit a second component of the balance signal. The ground section is configured to connect to a ground signal. The first microstrip, the second microstrip, and the conductive ground are all disposed on the insulation substrate, and a cross-sectional area of at least a part of the first microstrip and/or at least a part of the second microstrip is gradient.

公开(公告)号：US20200292770A1

公开(公告)日：2020-09-17

申请号：US16888121

申请日：2020-05-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Daochun MO ,  Qingzhi LIU ,  Xiaofei XU ,  Wenyang LEI ,  Chuang WANG ,  Linchun WANG

IPC: G02B6/43 ,  H04B10/80 ,  H04Q11/00

Abstract: This application discloses an optical backplane system, which includes a first upper-level optical interconnection module, a first lower-level optical interconnection module, and a second lower-level optical interconnection module. The first upper-level optical interconnection module includes M1 first interfaces and N1 second interfaces in connection relationships. The first lower-level optical interconnection module includes L1 third interfaces and K1 fourth interfaces in connection relationships. The second lower-level optical interconnection module includes L2 third interfaces and K2 fourth interfaces in connection relationships. The first upper-level optical interconnection module is connected to one of the L1 third interfaces of the first lower-level optical interconnection module by using one of the N1 second interfaces. The first upper-level optical interconnection module is connected to one of the L2 third interfaces of the second lower-level optical interconnection module by using another one of the N1 second interfaces.