公开(公告)号：US20190222436A1

公开(公告)日：2019-07-18

申请号：US16365863

申请日：2019-03-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xiaofei XU ,  Qingzhi LIU ,  Xiaojun ZHANG ,  Linchun WANG ,  Jingzhou YU

IPC: H04L12/28 ,  H04L12/931 ,  H04L12/24 ,  H04Q11/00

CPC classification number: H04L12/2885 ,  H04L12/00 ,  H04L41/0806 ,  H04L49/40 ,  H04Q11/0005 ,  H04Q11/0062 ,  H04Q2011/0052 ,  H04Q2011/0064

Abstract: The present disclosure relates to registration methods and devices. One example method includes obtaining, by a line card, line card information of the line card, the line card comprising a fabric interface chip optically interconnected to a switch fabric chip in at least one switch fabric card by using an optical fiber, and sending, by the line card, the line card information to the at least one switch fabric card through an optical interconnect path. The at least one switch fabric card registers the line card based on the line card information.

公开(公告)号：US20200292770A1

公开(公告)日：2020-09-17

申请号：US16888121

申请日：2020-05-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Daochun MO ,  Qingzhi LIU ,  Xiaofei XU ,  Wenyang LEI ,  Chuang WANG ,  Linchun WANG

IPC: G02B6/43 ,  H04B10/80 ,  H04Q11/00

Abstract: This application discloses an optical backplane system, which includes a first upper-level optical interconnection module, a first lower-level optical interconnection module, and a second lower-level optical interconnection module. The first upper-level optical interconnection module includes M1 first interfaces and N1 second interfaces in connection relationships. The first lower-level optical interconnection module includes L1 third interfaces and K1 fourth interfaces in connection relationships. The second lower-level optical interconnection module includes L2 third interfaces and K2 fourth interfaces in connection relationships. The first upper-level optical interconnection module is connected to one of the L1 third interfaces of the first lower-level optical interconnection module by using one of the N1 second interfaces. The first upper-level optical interconnection module is connected to one of the L2 third interfaces of the second lower-level optical interconnection module by using another one of the N1 second interfaces.