公开(公告)号：US20210044011A1

公开(公告)日：2021-02-11

申请号：US17077745

申请日：2020-10-22

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Liangsheng LIU ,  Ming CHANG ,  Jiajie TANG ,  Laicun LIN ,  Heng QU ,  Hailin DONG

IPC: H01Q1/52 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q1/22

Abstract: This application provides an example package structure with an antenna in package. The example package structure includes a substrate and a chip fastened under the substrate. The antenna in package includes a first radiator. The substrate includes a core layer and a first conductor layer, where the first radiator and a first conductive block are disposed on the first conductor layer. The package structure further includes a feed network, where the chip is coupled to the feed network, and the feed network provides feeding for the antenna in package. This application further provides a communications device.

公开(公告)号：US20220085509A1

公开(公告)日：2022-03-17

申请号：US17536332

申请日：2021-11-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Heng QU ,  Meijuan FU ,  Liguo ZHANG ,  Ying KANG

IPC: H01Q9/04 ,  H01Q1/24 ,  H01Q1/38

Abstract: This application provides a packaging structure, including an antenna in package and a radio frequency chip that are packaged together, where the antenna in package is fastened on the radio frequency chip. The antenna in package includes a radiator and at least two feeding parts, the at least two feeding parts are electrically connected to the radio frequency chip, the radio frequency chip is configured to receive or transmit a radio frequency signal, and at least one of the at least two feeding parts provides differential feeding for the radiator. This application further provides a network device and a terminal device, to reduce an antenna size and make the antenna easier to mount.