公开(公告)号：US20210044011A1

公开(公告)日：2021-02-11

申请号：US17077745

申请日：2020-10-22

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Liangsheng LIU ,  Ming CHANG ,  Jiajie TANG ,  Laicun LIN ,  Heng QU ,  Hailin DONG

IPC: H01Q1/52 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q1/22

Abstract: This application provides an example package structure with an antenna in package. The example package structure includes a substrate and a chip fastened under the substrate. The antenna in package includes a first radiator. The substrate includes a core layer and a first conductor layer, where the first radiator and a first conductive block are disposed on the first conductor layer. The package structure further includes a feed network, where the chip is coupled to the feed network, and the feed network provides feeding for the antenna in package. This application further provides a communications device.

公开(公告)号：US20200350274A1

公开(公告)日：2020-11-05

申请号：US16931819

申请日：2020-07-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jiajie TANG ,  Guanhong YE ,  Laicun LIN ,  Guowen LIU ,  Shuai ZHENG ,  Huafeng ZHANG

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A chip package device includes a chip, and a first substrate and a second substrate that are disposed opposite to each other, where the chip is disposed on a surface that is of the first substrate and that faces the second substrate. The chip is electrically connected to the first substrate through a first conductive part, the first substrate is electrically connected to the second substrate through a second conductive part, and a heat dissipation passage is formed between the chip and the second substrate through a thermally conductive layer. The chip package device may further include a molding compound that is configured to wrap the chip. The thermally conductive layer disposed between the chip and the second substrate can quickly dissipate a large amount of heat generated by the chip to the second substrate so that the chip maintains a normal temperature.