公开(公告)号：US20230269906A1

公开(公告)日：2023-08-24

申请号：US18308733

申请日：2023-04-28

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chao WANG ,  Hitoshi SAKAMOTO

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20272 ,  H05K1/0203 ,  H05K2201/064

Abstract: A cooling apparatus is provided, including a jet plate and a carrier plate provided with an accommodating groove, a coolant inlet, and a coolant outlet. The jet plate is in the accommodating groove, with nozzles provided on the jet plate in a protruding manner. A distribution cavity is between the jet plate and the carrier plate, and the distribution cavity communicates with the coolant inlet, which is for injection of cooling liquid. A collection cavity for backflow of the cooling liquid is formed in the accommodating groove, and is separated from the distribution cavity. The coolant outlet communicates with the collection cavity. The cooling liquid is distributed to the jet plate through the distribution cavity, and is sprayed to the collection cavity through the nozzles for heat exchange, and the cooling liquid obtained through heat exchange is converged in the collection cavity and flows out through the coolant outlet.