公开(公告)号：US12132249B2

公开(公告)日：2024-10-29

申请号：US17916034

申请日：2021-03-03

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Rui Yu ,  Hsiang Hui Chang ,  Wenping Jia

IPC: H01Q1/22 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01Q1/2283 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985

Abstract: An antenna module includes: a first insulation medium substrate, including a first section provided with a first groove and a second section, where an integrated circuit is disposed in the first groove; a flexible substrate including a conductive structure, where the flexible substrate is stacked on the first insulation medium substrate, and a part that is of the flexible substrate and that is located between the first section and the second section is bendable; and an antenna structure, including a first metal structure that is disposed on the first section and that is connected to the conductive structure and the integrated circuit, and a second metal structure that is disposed on the second section and that is connected to the conductive structure. This avoids a warping problem caused by different thermal expansion coefficients of a plastic packaging material and a substrate, and reduces a risk of product failure.