公开(公告)号：US20240288833A1

公开(公告)日：2024-08-29

申请号：US18564240

申请日：2022-05-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Rongguang YANG ,  Menglong ZHAO ,  Qian HE ,  Bing LIU ,  Jianming GAO ,  Qinjun PAN

IPC: G04G17/04 ,  H01Q1/27

CPC classification number: G04G17/04 ,  H01Q1/273

Abstract: Embodiments of this application disclose a wearable device. The wearable device includes a wearable device body and a housing that covers the wearable device body. The housing is made of an insulating material, the housing includes at least two spring bars, two spring bars are arranged in parallel and spaced from each other and both extend in a same direction, a connection line between ends of the two spring bars is located outside the wearable device, and a conductive component is disposed on the spring bar. The wearable device body includes a mainboard, the mainboard is configured to feed power to the conductive component, and the conductive component is used as an antenna.

公开(公告)号：US20240248433A1

公开(公告)日：2024-07-25

申请号：US18560911

申请日：2022-03-28

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Rongguang YANG ,  Huiting ZHONG ,  Bing LIU ,  Jianming GAO ,  Menglong ZHAO ,  Bin ZHANG ,  Huilan LI ,  Pan ZHANG ,  Xiaogang GOU

IPC: G04B37/22 ,  G04B37/00 ,  H05K5/00 ,  H05K5/02

CPC classification number: G04B37/223 ,  G04B37/0091 ,  H05K5/003 ,  H05K5/0213

Abstract: The wearable electronic device includes a housing and a circuit board assembly. The circuit board assembly is located inside the housing, and is fastened relative to the housing. The housing includes a carbon fiber material, and the housing has an inner surface. The housing includes a conductive layer disposed on the inner surface. The conductive layer electrically connects the carbon fiber material scattered in the housing. The housing is electrically connected to the circuit board assembly by using the conductive layer. In the technical solution, the housing is integrally formed as a conductor by using the conductive layer disposed on the inner surface of the housing, and the housing is further electrically connected to the circuit board assembly by using the conductive layer.

公开(公告)号：US20170352949A1

公开(公告)日：2017-12-07

申请号：US15538837

申请日：2014-12-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Chen ZHANG ,  Jianming GAO ,  Yibo CHEN ,  Bing LIU

IPC: H01Q1/38 ,  H01Q1/22 ,  H01Q1/24 ,  H05K7/14

CPC classification number: H01Q1/38 ,  H01Q1/22 ,  H01Q1/243 ,  H01Q5/335 ,  H01Q7/00 ,  H05K7/1428 ,  H05K7/1438

Abstract: Embodiments of the present disclosure disclose an antenna, and relate to the field of wireless communications. In the antenna, radiation parts of the antenna are disposed on at least two layers of circuit boards on a printed circuit board: a top layer circuit board and a first layer circuit board, so that lengths of the radiation parts of the antenna are reduced, and space occupied by a printed wire of the antenna on the PCB is reduced. Therefore, reducing a PCB size becomes possible, a size of a terminal using the reduced-size PCB may also be correspondingly reduced, and the terminal may be further miniaturized.