公开(公告)号：US20250098070A1

公开(公告)日：2025-03-20

申请号：US18724156

申请日：2022-12-05

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Tong ZHANG ,  Fan JIANG ,  Heyujia TANG ,  Haisheng ZHOU ,  Dan WEI ,  Kelin LI ,  Jiguang LI ,  Hao WANG

IPC: H05K1/14 ,  H05K1/11 ,  H05K3/36

Abstract: The first circuit board is a flexible printed circuit, and a stiffener and one or more first pads are disposed on a first surface of the first circuit board. The stiffener is provided with first through holes, at least one first pad is located in one first through hole of the the first through holes, and hardness of the stiffener is greater than hardness of the first circuit board. In addition, second pads are disposed on the second circuit board, and the at least one first pad is soldered to the second pad, to implement an electrical connection between the first circuit board and the second circuit board.