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公开(公告)号：US20230225078A1
公开(公告)日：2023-07-13
申请号：US18185861
申请日：2023-03-17
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Xiaoguang SUN , Junen GAO , Huan PENG
CPC classification number: H05K7/20272 , H05K1/0203 , G01M3/182 , H05K2201/064
Abstract: The present disclosure relates to heat dissipation apparatuses. In an example, a node includes a structural module, a circuit board, a liquid pipe, and a liquid leakage monitoring apparatus. The circuit board is securely mounted on the structural module, and an electronic component including a chip is disposed on the circuit board. The liquid pipe is disposed on the circuit board, and is configured to dissipate heat for the electronic component on the circuit board. The liquid leakage monitoring apparatus includes a drainage pipe sleeved outside the liquid pipe. There is a specific gap between the drainage pipe and the liquid pipe. In response to at least that leakage occurs in the liquid pipe, leaked coolant flows in the drainage pipe.
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公开(公告)号：US20250076956A1
公开(公告)日：2025-03-06
申请号：US18956698
申请日：2024-11-22
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Abstract: The present disclosure relates to computer system power supply methods, apparatuses, and devices. In one example method, a power management circuit in a computer system obtains a parameter that affects a power supply capability, determines, based on the parameter, the power supply capability of a power supply to provide a burst power for a component in the computer system, and controls the power supply to supply power to the component in the computer system based on the power supply capability. The power management circuit determines the power supply capability of the power supply based on the real-time dynamic parameter that affects the power supply capability, and controls the power supply to provide electric energy of the burst power for the component in the computer system based on the power supply capability of the power supply.
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