公开(公告)号：US20210410336A1

公开(公告)日：2021-12-30

申请号：US17475088

申请日：2021-09-14

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xidong YAO ,  Xiaoguang SUN ,  Dongming LU

IPC: H05K7/20

Abstract: The cabinet includes a body and a heat dissipation apparatus. A plurality of installation slots for servers to enter along a preset installation direction are disposed on the body. The heat dissipation apparatus is configured to perform heat dissipation on devices of the servers, the heat dissipation apparatus is disposed on at least one side of the body along the installation direction, and the heat dissipation apparatus is connected to the devices of the servers. In this way, heat dissipation is performed on each server in the body, and space reserved between two adjacent rows of cabinets can be effectively used to reduce occupation of space in a left-right direction or an up-down direction in the body, thereby reducing limitation on a size of the cabinet and a size of a device in the cabinet.

公开(公告)号：US20230275628A1

公开(公告)日：2023-08-31

申请号：US18312095

申请日：2023-05-04

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chenhui GE ,  Linlin WANG ,  Liang LI ,  Haizheng TANG ,  Jie LIN ,  Jiachong ZHOU ,  Xiaoguang SUN ,  Shiguo GUAN

IPC: H04B7/06 ,  H04W36/08

CPC classification number: H04B7/0602 ,  H04W36/085

Abstract: Embodiments of this application provide antenna switching methods and apparatuses. In an implementation, a first communication device determines a first antenna identifier based on air interface transmission information, the first communication device sends the first antenna identifier to a digital switch, and the digital switch switches from a second switch state to a first switch state based on the first antenna identifier, where the first switch state indicates that a second communication device communicates with the first antenna within a first time unit, and the second switch state indicates that the second communication device communicates with a second antenna within a second time unit.

公开(公告)号：US20230225078A1

公开(公告)日：2023-07-13

申请号：US18185861

申请日：2023-03-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xiaoguang SUN ,  Junen GAO ,  Huan PENG

IPC: H05K7/20 ,  H05K1/02 ,  G01M3/18

CPC classification number: H05K7/20272 ,  H05K1/0203 ,  G01M3/182 ,  H05K2201/064

Abstract: The present disclosure relates to heat dissipation apparatuses. In an example, a node includes a structural module, a circuit board, a liquid pipe, and a liquid leakage monitoring apparatus. The circuit board is securely mounted on the structural module, and an electronic component including a chip is disposed on the circuit board. The liquid pipe is disposed on the circuit board, and is configured to dissipate heat for the electronic component on the circuit board. The liquid leakage monitoring apparatus includes a drainage pipe sleeved outside the liquid pipe. There is a specific gap between the drainage pipe and the liquid pipe. In response to at least that leakage occurs in the liquid pipe, leaked coolant flows in the drainage pipe.