公开(公告)号：US11430760B2

公开(公告)日：2022-08-30

申请号：US16931819

申请日：2020-07-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jiajie Tang ,  Guanhong Ye ,  Laicun Lin ,  Guowen Liu ,  Shuai Zheng ,  Huafeng Zhang

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A chip package device includes a chip, and a first substrate and a second substrate that are disposed opposite to each other, where the chip is disposed on a surface that is of the first substrate and that faces the second substrate. The chip is electrically connected to the first substrate through a first conductive part, the first substrate is electrically connected to the second substrate through a second conductive part, and a heat dissipation passage is formed between the chip and the second substrate through a thermally conductive layer. The chip package device may further include a molding compound that is configured to wrap the chip. The thermally conductive layer disposed between the chip and the second substrate can quickly dissipate a large amount of heat generated by the chip to the second substrate so that the chip maintains a normal temperature.