公开(公告)号：US20240106274A1

公开(公告)日：2024-03-28

申请号：US18263872

申请日：2021-12-15

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Shuai Zheng ,  Gang Ye ,  Qinghui Hou

IPC: H02J50/12 ,  H02J7/04 ,  H02J50/80

CPC classification number: H02J50/12 ,  H02J7/04 ,  H02J50/80

Abstract: An electronic device is provided, which includes a receive coil, a wireless electric energy receiver, a three-level buck circuit, a battery, and a receive end controller. A charging control method is also provided that includes: obtaining a battery voltage, and sending a first control signal and a second control signal based on the battery voltage. The wireless electric energy receiver converts, based on the first control signal, an alternating current generated by the receive coil through induction into a direct current, and outputs a first voltage, V1, to charge the battery in a first voltage mode. The three-level buck circuit bucks an output voltage of the wireless electric energy receiver based on the second control signal, and then outputs a voltage to the battery.

公开(公告)号：US11430760B2

公开(公告)日：2022-08-30

申请号：US16931819

申请日：2020-07-17

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jiajie Tang ,  Guanhong Ye ,  Laicun Lin ,  Guowen Liu ,  Shuai Zheng ,  Huafeng Zhang

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A chip package device includes a chip, and a first substrate and a second substrate that are disposed opposite to each other, where the chip is disposed on a surface that is of the first substrate and that faces the second substrate. The chip is electrically connected to the first substrate through a first conductive part, the first substrate is electrically connected to the second substrate through a second conductive part, and a heat dissipation passage is formed between the chip and the second substrate through a thermally conductive layer. The chip package device may further include a molding compound that is configured to wrap the chip. The thermally conductive layer disposed between the chip and the second substrate can quickly dissipate a large amount of heat generated by the chip to the second substrate so that the chip maintains a normal temperature.