公开(公告)号：US11490545B2

公开(公告)日：2022-11-01

申请号：US17089089

申请日：2020-11-04

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Lei Cao ,  Shoubiao Xu ,  Shanjiu Chi

IPC: H05K7/20 ,  G06F1/20

Abstract: A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.

公开(公告)号：US20230032386A1

公开(公告)日：2023-02-02

申请号：US17949801

申请日：2022-09-21

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Lei Cao ,  Shoubiao Xu ,  Shanjiu Chi

IPC: H05K7/20 ,  G06F1/20

Abstract: A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.

公开(公告)号：US20210051818A1

公开(公告)日：2021-02-18

申请号：US17089089

申请日：2020-11-04

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Lei Cao ,  Shoubiao Xu ,  Shanjiu Chi

IPC: H05K7/20 ,  G06F1/20

Abstract: A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.

公开(公告)号：US11737242B2

公开(公告)日：2023-08-22

申请号：US17949801

申请日：2022-09-21

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Lei Cao ,  Shoubiao Xu ,  Shanjiu Chi

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20418 ,  G06F1/20 ,  H05K7/20709

Abstract: A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.