公开(公告)号：US20250151230A1

公开(公告)日：2025-05-08

申请号：US19020494

申请日：2025-01-14

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Dingfang LI ,  Min LI ,  Fei YU ,  Lu BAI

IPC: H05K7/20

Abstract: This application provides example electronic assemblies. One example electronic assembly includes a first heat dissipation panel, a second heat dissipation panel, and a first circuit board assembly. The first heat dissipation panel is provided with a runner. The second heat dissipation panel is fastened to the first heat dissipation panel, and encloses a working medium cavity with the first heat dissipation panel, where the working medium cavity is in communication with the runner. The first circuit board assembly includes a first circuit board, a first component, and a second component, the first component and the second component are both disposed on a same side of the first circuit board, and the first circuit board and the first heat dissipation panel are disposed in a stacked manner.

公开(公告)号：US20250048590A1

公开(公告)日：2025-02-06

申请号：US18926435

申请日：2024-10-25

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Min LI ,  Guangjing WANG ,  Lu BAI ,  Fei YU

IPC: H05K7/20

Abstract: This application provides a flexible liquid cooling heat dissipation unit. The flexible liquid cooling heat dissipation unit is configured to dissipate heat for a heat generation component. A liquid inlet and a liquid outlet are provided on the flexible liquid cooling heat dissipation unit. A heat exchange cavity that is used for accommodating a coolant and allowing the coolant to flow from the liquid inlet to the liquid outlet is provided in the flexible liquid cooling heat dissipation unit. The liquid cooling heat dissipation unit includes a flexible sheet material. The flexible sheet material is obtained by compounding a plurality of functional film layers, the plurality of functional film layers include at least one anti-penetration layer, and permeability of the anti-penetration layer is less than 1 g/m2/24 hr.