公开(公告)号：US20250151230A1

公开(公告)日：2025-05-08

申请号：US19020494

申请日：2025-01-14

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Dingfang LI ,  Min LI ,  Fei YU ,  Lu BAI

IPC: H05K7/20

Abstract: This application provides example electronic assemblies. One example electronic assembly includes a first heat dissipation panel, a second heat dissipation panel, and a first circuit board assembly. The first heat dissipation panel is provided with a runner. The second heat dissipation panel is fastened to the first heat dissipation panel, and encloses a working medium cavity with the first heat dissipation panel, where the working medium cavity is in communication with the runner. The first circuit board assembly includes a first circuit board, a first component, and a second component, the first component and the second component are both disposed on a same side of the first circuit board, and the first circuit board and the first heat dissipation panel are disposed in a stacked manner.

公开(公告)号：US20220015268A1

公开(公告)日：2022-01-13

申请号：US17486593

申请日：2021-09-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yiying JIAN ,  Dingfang LI ,  Xinhu GONG ,  Gaoliang XIA

IPC: H05K7/20

Abstract: The present disclosure relates to heat dissipation apparatus. One example heat dissipation apparatus includes a heat dissipation assembly and a bracket assembly, where the heat dissipation assembly is configured to dissipate heat for a server chip and includes a substrate and a heat sink, the heat dissipation assembly is connected to the bracket assembly, the bracket assembly includes a bracket and a plurality of first elastic structural members that are disposed on the bracket, each first elastic structural member includes a supporting portion and a connection portion, and at least one hook is disposed on the connection portion.

公开(公告)号：US20240389262A1

公开(公告)日：2024-11-21

申请号：US18785125

申请日：2024-07-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Dingfang LI ,  Hui JIA ,  Gaoliang XIA

IPC: H05K7/20

Abstract: A heat dissipation apparatus is provided. The apparatus includes: a cover plate, a flow distribution plate, and a heat dissipation member. A first flow inlet and outlet are disposed in the cover plate, a flow inlet cavity and a flow outlet cavity that are isolated from each other are disposed in the cover plate, the first flow inlet and outlet communicate with the flow inlet and outlet cavity respectively. The heat dissipation member includes a heat dissipation portion, where a heat dissipation flow channel is formed. A second flow inlet and second flow outlets are provided in the flow distribution plate, the second flow inlet communicates with the flow inlet cavity and the heat dissipation flow channel. The second flow outlets are respectively located at the two ends of the heat dissipation flow channel, and communicate with the heat dissipation flow channel and the flow outlet cavity.

公开(公告)号：US20230239995A1

公开(公告)日：2023-07-27

申请号：US18191946

申请日：2023-03-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hui JIA ,  Xinhu GONG ,  Dingfang LI

IPC: H05K1/02

CPC classification number: H05K1/021 ,  H05K1/0204

Abstract: A heat sink includes: a first heat dissipation module in thermal contact with the first heat source; a heat dissipation base in thermal contact with the second heat source, where the heat dissipation base is fixed on the circuit board, the first heat dissipation module is floatingly fixed on the heat dissipation base, and the heat dissipation base is provided with a first opening; and a second heat dissipation module, disposed between the first heat dissipation module and the heat dissipation base, where the second heat dissipation module is fixed on the heat dissipation base, the second heat dissipation module is provided with a second opening corresponding to the first opening, and the first heat dissipation module sequentially runs through the second opening and the first opening to be in thermal contact with the first heat source.