公开(公告)号：US20230200028A1

公开(公告)日：2023-06-22

申请号：US18169888

申请日：2023-02-16

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Nengwu Xiang ,  Xiaolin Jia ,  Shuncheng Pan ,  Pinqiang Liu ,  Jianqiang Yin

IPC: H05K7/20

CPC classification number: H05K7/20854 ,  H05K7/20872 ,  H05K7/20863 ,  H05K7/20254 ,  H05K7/20454

Abstract: An in-vehicle computing apparatus comprises a mainboard, a heat dissipation component, and a target printed circuit board (PCB). A system on chip (SOC) and a connection component are disposed on the target PCB. A side of the mainboard is attached to the heat dissipation component. The target PCB is located on a side of the heat dissipation component that faces away from the mainboard, and is detachably connected to the heat dissipation component by using the connection component.