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公开(公告)号：US20220183192A1
公开(公告)日：2022-06-09
申请号：US17682186
申请日：2022-02-28
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yaofeng Peng , Jianqiang Yin
IPC: H05K7/20
Abstract: A heat radiator comprising a heat dissipation plate, where a plurality of circumferentially disposed heat dissipation regions are disposed on the heat radiator, a plurality of first heat dissipation fins disposed in parallel with each other are disposed at intervals in each heat dissipation region, a heat dissipation channel is formed between adjacent first heat dissipation fins, one end that is of the heat dissipation channel and that is away from a center of the heat dissipation plate is an air inlet, and a direction that is above the heat dissipation channel and that is towards a hollow region is an air outlet.
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公开(公告)号：US11839065B2
公开(公告)日：2023-12-05
申请号：US17574766
申请日：2022-01-13
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Yonghai Mao , Zhenming Hu , Jianqiang Yin , Xiaofei Li
CPC classification number: H05K7/20872 , H05K1/0203 , H05K7/20172 , H05K7/20854 , H05K7/20881 , H05K7/20254 , H05K7/20336 , H05K7/20454 , H05K7/20863
Abstract: This application discloses a vehicle-mounted device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.
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公开(公告)号：US11073877B2
公开(公告)日：2021-07-27
申请号：US16989174
申请日：2020-08-10
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jianqiang Yin , Zhenming Hu , Yonghai Mao , Xiaofei Li
Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.
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公开(公告)号：US20230301028A1
公开(公告)日：2023-09-21
申请号：US18322001
申请日：2023-05-23
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jianqiang Yin
IPC: H05K7/20
CPC classification number: H05K7/2039 , H05K7/20272 , H05K7/20263 , H05K7/20136 , H05K7/20927 , B60W60/00
Abstract: A heat dissipation apparatus includes a liquid storage tank, a liquid pump, a first heat exchanger, a second heat exchanger and a heat dissipation fan. The liquid storage tank stores liquid coolant. The liquid pump extracts the liquid coolant from the liquid storage tank, and pressurizes the liquid coolant to enable the liquid coolant to circulate sequentially along the liquid storage tank, the first heat exchanger, and the second heat exchanger. The first heat exchanger is in contact with a heat source, absorbs heat from the heat source, and transfers the heat to the liquid coolant. The heat dissipation fan generates cooling air for the second heat exchanger to accelerate air flow around the second heat exchanger. The second heat exchanger absorbs heat from the liquid coolant, and volatilizes the heat into air.
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公开(公告)号：US20240149637A1
公开(公告)日：2024-05-09
申请号：US18413050
申请日：2024-01-16
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Jianqiang Yin
IPC: B60H1/00
CPC classification number: B60H1/00785 , B60H1/00899
Abstract: A device cooling system includes a vehicle-mounted device, a main controller, and a valve set. A liquid inlet pipe and a liquid outlet pipe are disposed on the vehicle-mounted device, the liquid inlet pipe is connected to the valve set, the valve set is connected to an electric drive liquid-cooling loop to form a first path, the valve set is connected to a battery liquid-cooling loop to form a second path, and the valve set is configured to switch a switch status to control to connect the first path or the second path. A temperature and humidity detection apparatus is disposed in the vehicle-mounted device. The main controller is configured to: obtain a dew point temperature based on a temperature and humidity that are detected by the temperature and humidity detection apparatus, and control, based on the dew point temperature, the valve set to switch the switch status.
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Patent Agency Ranking
公开(公告)号：US20230200028A1
公开(公告)日：2023-06-22
申请号：US18169888
申请日：2023-02-16
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Nengwu Xiang , Xiaolin Jia , Shuncheng Pan , Pinqiang Liu , Jianqiang Yin
IPC: H05K7/20
CPC classification number: H05K7/20854 , H05K7/20872 , H05K7/20863 , H05K7/20254 , H05K7/20454
Abstract: An in-vehicle computing apparatus comprises a mainboard, a heat dissipation component, and a target printed circuit board (PCB). A system on chip (SOC) and a connection component are disposed on the target PCB. A side of the mainboard is attached to the heat dissipation component. The target PCB is located on a side of the heat dissipation component that faces away from the mainboard, and is detachably connected to the heat dissipation component by using the connection component.
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公开(公告)号：US20220142010A1
公开(公告)日：2022-05-05
申请号：US17574766
申请日：2022-01-13
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Yonghai Mao , Zhenming Hu , Jianqiang Yin , Xiaofei Li
Abstract: This application discloses a vehicle-mounted device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.
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公开(公告)号：US12163566B2
公开(公告)日：2024-12-10
申请号：US17716469
申请日：2022-04-08
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Zhenming Hu , Jianqiang Yin , Xiaofei Li , Rucheng Zhu
Abstract: One example vibration damping bracket provided in some embodiments of this application includes a fastening bracket, a first bracket body, a second bracket body, a first vibration damping component, and a second vibration damping component. The first bracket body is elastically connected to the fastening bracket by using the first vibration damping component. The second bracket body is elastically connected to the first bracket body by using the second vibration damping component. The first vibration damping component includes a metal elastic part configured to absorb vibration, and the second vibration damping component includes a rubber elastic part configured to absorb vibration.
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公开(公告)号：US20240057300A1
公开(公告)日：2024-02-15
申请号：US18495735
申请日：2023-10-26
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Yonghai Mao , Zhenming Hu , Jianqiang Yin , Xiaofei Li
CPC classification number: H05K7/20872 , H05K1/0203 , H05K7/20172 , H05K7/20854 , H05K7/20881 , H05K7/20336 , H05K7/20454 , H05K7/20254 , H05K7/20863
Abstract: This application discloses a vehicle-mountable device comprising: a first temperature equalization board and a PCB are fastened inside a housing. The first temperature equalization board is close to a first inner wall of the housing. The PCB is close to a second inner wall of the housing. The first inner wall is opposite to the second inner wall. A first protrusion is disposed on a side that is of the first temperature equalization board and that is close to the PCB. A first heat pipe is disposed on a side that is of the first temperature equalization board and that is close to the first inner wall. A first heat emission component is disposed on a side that is of the PCB and that is close to the first temperature equalization board. A position of the first protrusion corresponds to a position of the first heat emission component.
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公开(公告)号：US11726534B2
公开(公告)日：2023-08-15
申请号：US17378029
申请日：2021-07-16
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jianqiang Yin , Zhenming Hu , Yonghai Mao , Xiaofei Li
CPC classification number: G06F1/20 , H05K7/20172 , H05K7/20318 , H05K7/20409 , G06F2200/201
Abstract: An in-vehicle computing apparatus in an intelligent vehicle and an intelligent vehicle, where the in-vehicle computing apparatus includes two stacked mainboards, and a radiator that is disposed between the two mainboards and configured to dissipate heat for the two mainboards, and a sealing plate connected to the radiator and disposed on a side that is of each mainboard and that is away from the radiator, where each sealing plate and the radiator seal a corresponding mainboard between the sealing plate and the radiator.
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