公开(公告)号：US20230188104A1

公开(公告)日：2023-06-15

申请号：US18169516

申请日：2023-02-15

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Wei XU ,  Po SHI ,  Zhengde YANG ,  Yufeng WANG ,  Junhao ZOU ,  Qingquan LUO ,  Shengchang SHANGGUAN

IPC: H03F3/24

CPC classification number: H03F3/245 ,  H03F2200/451 ,  H03F2200/102 ,  H03F2200/231

Abstract: Example power amplifier chips and communication devices are described. One example power amplifier chip includes a package housing and a plurality of power amplifier dies. The plurality of power amplifier dies are packaged in the package housing, and each of the plurality of power amplifier dies includes at least one stage of power amplifier.