公开(公告)号：US20240178160A1

公开(公告)日：2024-05-30

申请号：US18437428

申请日：2024-02-09

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Ming WU ,  Zhiqiang XIANG ,  Fei DING ,  Qidong WANG

IPC: H01L23/62 ,  H01L23/498

CPC classification number: H01L23/62 ,  H01L23/49822

Abstract: A package structure and an electronic apparatus includes a power semiconductor device, a wire, and a shape memory object. The wire is electrically connected to the power semiconductor device, the shape memory object is in contact with the wire, and the shape memory object is configured to deform when temperature of the shape memory object is not less than preset temperature, to enable a current in the wire to be cut off or reduced. In this way, impact of high temperature generated by the power semiconductor device when an overcurrent occurs in the power semiconductor device on the printed circuit board is reduced, a possibility that a printed circuit board is damaged is greatly reduced, and an overcurrent self-protection capability of the package structure is implemented.