公开(公告)号：US20210082842A1

公开(公告)日：2021-03-18

申请号：US17106520

申请日：2020-11-30

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Qijing HE ,  Xiaojing LIAO ,  Zhaozheng HOU

IPC: H01L23/66 ,  H04B1/04 ,  H01L23/552 ,  H01L25/16 ,  H01L21/56 ,  H01L23/00

Abstract: A wireless transmission module, chips, a passive component, and a coil are integrated into an integral structure, so that an integration level of the wireless transmission module is improved. In addition, the integral structure can effectively implement independence of the module, and the independent module can be flexibly arranged inside structural design of an electronic device, and does not need to be disposed on a mainboard of the electronic device. Only an input terminal of the wireless transmission module needs to be retained on the mainboard of the electronic device. In addition, the integral structure can further effectively increase a capability of a product for working continuously and normally in an extremely harsh scenario, and improve product reliability. In addition, in the structure of the wireless transmission module, the chips and the coil are integrated, and signal transmission paths between the chips and the coil are relatively short.