公开(公告)号：US20230299018A1

公开(公告)日：2023-09-21

申请号：US18324329

申请日：2023-05-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chen KANG ,  Chao SHEN ,  Xiaojing LIAO ,  Junhe WANG

IPC: H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H05K1/18 ,  H01L23/498

CPC classification number: H01L23/564 ,  H01L23/552 ,  H01L23/31 ,  H05K1/185 ,  H01L23/49822 ,  H05K2201/0206

Abstract: This application provides a package substrate and a communication device. The package substrate includes a package body, a first circuit layer, a second circuit layer, an electronic component, and a moisture-proof structure. The package body includes a top surface and a bottom surface that are oppositely disposed, the first circuit layer is disposed on the top surface of the package body, and the second circuit layer is disposed on the bottom surface of the package body. The electronic component is packaged inside the package body. The moisture-proof structure is disposed on the package body and is connected between the first circuit layer and the second circuit layer, and the moisture-proof structure surrounds the electronic component. According to technical solutions of this application, external water vapor can be prevented from entering the package substrate from a peripheral side of the package substrate, to effectively prevent moisture absorption.

公开(公告)号：US20230028233A1

公开(公告)日：2023-01-26

申请号：US17955796

申请日：2022-09-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chao SHEN ,  Zhiqiang XIANG ,  Xiaojing LIAO

IPC: H01H85/046 ,  H01H85/06 ,  H05K1/18

Abstract: This application provides an embedded substrate, a circuit board assembly, and an electronic device. The embedded substrate in this application includes an insulation layer, and an electronic element and a conductive connector that are embedded inside the insulation layer. The conductive connector is electrically connected to the electronic element. The conductive connector includes at least one fuse unit, the fuse unit includes a fusible structure and two electrical connection ends, the fusible structure is connected between the two electrical connection ends in a direction of an electrical path of the conductive connector, and the fusible structure is configured to be blown when a passing current exceeds a preset current threshold, to disconnect an electrical connection between the electronic element and an external connection end. In this application, maintenance and replacement costs are low during current burning prevention, and a volume is compact.

公开(公告)号：US20230021432A1

公开(公告)日：2023-01-26

申请号：US17872473

申请日：2022-07-25

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hao PENG ,  Xiaojing LIAO ,  Zhaozheng HOU

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/367 ,  H01L23/552 ,  H01L21/683 ,  H01L21/48

Abstract: This application discloses a chip package assembly, an electronic device, and a preparation method of a chip package assembly. The chip package assembly includes a package substrate, a chip, and a heat dissipation part. The package substrate includes an upper conductive layer, a lower conductive layer, and a conductive part connected between the upper conductive layer and the lower conductive layer. The chip includes a front electrode and a back electrode that are disposed opposite each other, the chip is embedded in the package substrate, the conductive part surrounds the chip, the front electrode is connected to the lower conductive layer, and the back electrode is connected to the upper conductive layer. The heat dissipation part is connected to a surface of the upper conductive layer that is away from the chip. The upper conductive layer, the lower conductive layer, and the conductive part each conduct heat.

公开(公告)号：US20230018603A1

公开(公告)日：2023-01-19

申请号：US17863047

申请日：2022-07-12

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hao PENG ,  Xiaojing LIAO

IPC: H01L23/482 ,  H01L23/00 ,  H01L23/538

Abstract: This application discloses a package structure and a package system. The package structure may be used for packaging various types of chips, and is coupled to a PCB, so as to form the package system. The package structure includes a package base layer, a chip, a package body, and a connecting assembly. The package base layer has a first surface and a second surface that are opposite to each other. The chip is coupled to the first surface, and there is a chip pad on a surface that is of the chip and that is away from the package base layer. The package body covers the package base layer and the chip to protect the structure, and the chip pad is wired to a surface of the package body through the connecting assembly.

公开(公告)号：US20210082842A1

公开(公告)日：2021-03-18

申请号：US17106520

申请日：2020-11-30

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Qijing HE ,  Xiaojing LIAO ,  Zhaozheng HOU

IPC: H01L23/66 ,  H04B1/04 ,  H01L23/552 ,  H01L25/16 ,  H01L21/56 ,  H01L23/00

Abstract: A wireless transmission module, chips, a passive component, and a coil are integrated into an integral structure, so that an integration level of the wireless transmission module is improved. In addition, the integral structure can effectively implement independence of the module, and the independent module can be flexibly arranged inside structural design of an electronic device, and does not need to be disposed on a mainboard of the electronic device. Only an input terminal of the wireless transmission module needs to be retained on the mainboard of the electronic device. In addition, the integral structure can further effectively increase a capability of a product for working continuously and normally in an extremely harsh scenario, and improve product reliability. In addition, in the structure of the wireless transmission module, the chips and the coil are integrated, and signal transmission paths between the chips and the coil are relatively short.