公开(公告)号：US20240049056A1

公开(公告)日：2024-02-08

申请号：US18257425

申请日：2021-12-09

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Haw-Wei SHU ,  Tongbo WANG ,  Ming ZHOU ,  Ronggui XIE

IPC: H04W28/08 ,  H04W76/15 ,  H04W28/02 ,  H04W72/543

CPC classification number: H04W28/0975 ,  H04W76/15 ,  H04W28/0215 ,  H04W72/543

Abstract: The present disclosure relates to terminal devices, multi-link communication methods, and chips. In one example method, when a terminal device supports Wi-Fi and D2D (for example, V2X) communication, the terminal device may communicate with another terminal device in a multi-link collaborative transmission manner such as a Wi-Fi link and a D2D link to implement multi-link accelerated transmission in a local area network.