公开(公告)号：US20220013972A1

公开(公告)日：2022-01-13

申请号：US17382050

申请日：2021-07-21

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Suining HU ,  Tien Chieh SU ,  Shihao ZHANG ,  Gaobing LEI

IPC: H01R43/16 ,  C25D7/00 ,  H01R13/03 ,  H01R24/64 ,  H01R43/24 ,  C25D5/12 ,  C25D5/10

Abstract: Embodiments of this application disclose an electrical connector, including at least one first conductive terminal and at least one second conductive terminal, where a first electroplated layer is disposed on an outer surface of the first conductive terminal, a second electroplated layer is disposed on an outer surface of the second conductive terminal, and a material of the second electroplated layer is different from a material of the first electroplated layer. Electroplating costs of the electrical connector are reduced while corrosion resistance of the electrical connector is ensured. The embodiments of this application further disclose a mobile terminal and an electrical connector manufacturing method.

公开(公告)号：US20200235509A1

公开(公告)日：2020-07-23

申请号：US16648577

申请日：2017-09-20

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Suining HU ,  Tien Chieh SU ,  Shihao ZHANG ,  Gaobing LEI

IPC: H01R13/03 ,  H01R24/64 ,  H01R43/24 ,  C25D7/00 ,  C25D5/10

Abstract: An electrical connector, a mobile terminal, and an electrical connector manufacturing method therefor, the electrical connector including at least one first conductive terminal and at least one second conductive terminal, where a first electroplated layer is disposed on an outer surface of the first conductive terminal, a second electroplated layer is disposed on an outer surface of the second conductive terminal, and a material of the second electroplated layer is different from a material of the first electroplated layer. Electroplating costs of the electrical connector are reduced while corrosion resistance of the electrical connector is ensured.