公开(公告)号：US20230225081A1

公开(公告)日：2023-07-13

申请号：US18159709

申请日：2023-01-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zhiwen YANG ,  Tao YAN ,  Jie CHEN ,  Henglong ZOU ,  Qingying LIU

IPC: H05K7/20

CPC classification number: H05K7/20309 ,  H05K7/20154 ,  H05K7/20318 ,  H05K7/20336 ,  H05K7/20409

Abstract: A heat dissipation cabinet includes a cabinet body and a heat dissipation apparatus. A first accommodation region of the cabinet body can accommodate a plugboard in a stacked manner, and heat source components of the plugboard dissipate heat through the heat dissipation apparatus. An evaporator, a condenser, and an evaporation pipeline of the heat dissipation apparatus are connected to a liquid return pipeline to form a heat exchange loop, and the evaporator is in thermal contact with an outer surface of a heat source component. The condenser is disposed in a second accommodation region and located above the evaporator. A refrigerant flows in the heat exchange loop, to draw heat of the heat source component far to the condenser, and take away heat of the condenser using air generated by a fan. A second accommodation region is used as an independent air duct whose path is relatively short.