公开(公告)号：US20220328745A1

公开(公告)日：2022-10-13

申请号：US17850010

申请日：2022-06-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chengpeng YANG ,  Ningjun ZHU ,  Tinghui GUO

IPC: H01L35/08 ,  H01L35/32 ,  H01L35/34

Abstract: A thermoelectric cooler, a method for preparing a thermoelectric cooler, and an electronic device. The thermoelectric cooler includes two monocrystalline silicon substrates disposed opposite to each other and a plurality of semiconductor thermoelectric particles located between the two monocrystalline silicon substrates. An insulation layer is provided on a side that is of a monocrystalline silicon substrate and that faces the semiconductor thermoelectric particles. A conductive sheet is provided between the insulation layer and the semiconductor thermoelectric particles, and the conductive sheet is electrically connected to the semiconductor thermoelectric particles, so that the semiconductor thermoelectric particles form a serial connection circuit.