公开(公告)号：US12232250B2

公开(公告)日：2025-02-18

申请号：US17974619

申请日：2022-10-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chuncheng Gong ,  Li Fan ,  Weijin Pan ,  Junwei Mu ,  Ge Zhang

IPC: H01L23/00 ,  H01L23/32 ,  H05K1/02 ,  H05K1/18

Abstract: This application provides a stiffener ring and a surface packaging assembly. The stiffener ring is configured to correct warpage of a substrate of the surface packaging assembly. The stiffener ring includes an annular stiffener ring body and an adjustment block that is disposed at a same layer as the stiffener ring body and that is fastened to at least one corner of the stiffener ring body. A coefficient of thermal expansion of the adjustment block is less than a coefficient of thermal expansion of the stiffener ring body. Coordination between the adjustment block and the stiffener ring body alleviates an “M-shape” overpressure phenomenon of a warpage deformation caused by the stiffener ring to the substrate at a high temperature, reduces warpage of the substrate, and improves flatness of the surface packaging assembly.