公开(公告)号：US20240164056A1

公开(公告)日：2024-05-16

申请号：US18550265

申请日：2022-03-11

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Huipeng Wu ,  Xinpei Huang ,  Tao Liu ,  Along Zhou ,  Jian Shi

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20272 ,  G06F1/203 ,  H05K7/20254

Abstract: This application relates to the field of liquid cooling technologies, and provides a gas collection apparatus, configured to collect bubbles generated due to loss of a working medium in a liquid cooling apparatus. The gas collection apparatus includes a cooling plate. The cooling plate includes at least one gas collection structure disposed inside the cooling plate, a first flow channel disposed inside the cooling plate, a second flow channel disposed inside the gas collection structure, and at least one connecting channel configured to connect the first flow channel and the second flow channel. The at least one connecting channel is configured to transfer, to the second flow channel, bubbles carried when the working medium flows in the first flow channel. The at least one gas collection structure is configured to collect the bubbles from the second flow channel.