公开(公告)号：US20240235073A1

公开(公告)日：2024-07-11

申请号：US18610247

申请日：2024-03-19

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xuesheng Wu ,  Feng Wang ,  Zongxun Chen

IPC: H01R12/70 ,  H01R12/71 ,  H01R13/207 ,  H01R13/639 ,  H05K7/12

CPC classification number: H01R12/7047 ,  H01R12/718 ,  H01R13/207 ,  H01R13/639 ,  H05K7/12 ,  H05K2201/10189

Abstract: A chip assembly has a first clamping member, a chip, a chip socket, a circuit board, and a second clamping member in a sequentially stacked manner. The chip is electrically connected to the circuit board through the chip socket, and at least one side of the chip socket is in electrical contact with the chip or the circuit board. The chip assembly further comprises a plurality of first fasteners disposed around the chip and configured to lock the first clamping member and the second clamping member. The second clamping member has a protruding portion extending in a direction towards the first clamping member and located in an area enclosed by the first fasteners, and a part of an orthographic projection area of the protruding portion on the circuit board is located in an orthographic projection area of the chip on the circuit board.