公开(公告)号：US20240235073A1

公开(公告)日：2024-07-11

申请号：US18610247

申请日：2024-03-19

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xuesheng Wu ,  Feng Wang ,  Zongxun Chen

IPC: H01R12/70 ,  H01R12/71 ,  H01R13/207 ,  H01R13/639 ,  H05K7/12

CPC classification number: H01R12/7047 ,  H01R12/718 ,  H01R13/207 ,  H01R13/639 ,  H05K7/12 ,  H05K2201/10189

Abstract: A chip assembly has a first clamping member, a chip, a chip socket, a circuit board, and a second clamping member in a sequentially stacked manner. The chip is electrically connected to the circuit board through the chip socket, and at least one side of the chip socket is in electrical contact with the chip or the circuit board. The chip assembly further comprises a plurality of first fasteners disposed around the chip and configured to lock the first clamping member and the second clamping member. The second clamping member has a protruding portion extending in a direction towards the first clamping member and located in an area enclosed by the first fasteners, and a part of an orthographic projection area of the protruding portion on the circuit board is located in an orthographic projection area of the chip on the circuit board.

公开(公告)号：US20230420900A1

公开(公告)日：2023-12-28

申请号：US18466835

申请日：2023-09-14

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zongxun Chen ,  Jiankang Li ,  Huan Pei ,  Jiang Zhu

IPC: H01R33/76 ,  H01R13/652 ,  H01R12/57 ,  H01R12/71 ,  H01R13/6587

CPC classification number: H01R33/7664 ,  H01R13/652 ,  H01R12/57 ,  H01R12/716 ,  H01R13/6587

Abstract: An electronic assembly includes a first electronic component, a second electronic component, and an electrical connector connecting the first electronic component and the second electronic component. The electrical connector includes a first multilayer circuit board and a terminal that includes a plurality of signal terminals and a plurality of ground terminals. Each signal terminal is electrically connected to a signal interface of the first electronic component and a signal interface of the second electronic component. Signal terminals configured to transmit a same signal form one group of signal terminals, and at least one ground terminal is disposed between two adjacent groups of signal terminals. The first multilayer circuit board includes at least one layer of first ground copper sheet. The first electronic component includes a second multilayer circuit board, and the second multilayer circuit board includes at least one layer of second ground copper sheet.