公开(公告)号：US20230084279A1

公开(公告)日：2023-03-16

申请号：US17985327

申请日：2022-11-11

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Feng WANG ,  Youhu ZHAO ,  Yalei ZHANG ,  Yangyun XIE

IPC: H01L23/40 ,  H01L23/00

Abstract: A chip module includes a circuit board (2), a slot (21) disposed on a surface of one side of the circuit board (2), a lidless packaged chip (5), a heat radiator (4), and a substrate fixing assembly (6). The lidless packaged chip (5) includes a substrate (51) and a die (52) packaged on the substrate (51). The slot (21) is electrically connected to the circuit board (2), the lidless packaged chip (5) has a connecting part on one side of the substrate (51) facing away from the die (52), and the connecting part is inserted into the slot (21). The heat radiator (4) is press-fitted on one side of the die (52) facing away from the circuit board (2). The substrate fixing assembly (6) is press-fitted at a periphery of one side of the substrate (51) facing away from the circuit board (2) and avoids the die (52).