公开(公告)号：US12100715B2

公开(公告)日：2024-09-24

申请号：US17158664

申请日：2021-01-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Huajun Cao ,  Guozhong Ma ,  Yukun Guo ,  Yong Lu

IPC: H01L27/12 ,  H01L23/10 ,  H01Q1/38 ,  H01Q21/00 ,  G02F1/1368 ,  H01L25/16 ,  H10K59/12

CPC classification number: H01L27/1255 ,  H01L23/10 ,  H01Q21/00 ,  G02F1/1368 ,  H01L25/167 ,  H10K59/12

Abstract: Example array substrates are provided. One example array substrate includes an underlying substrate, an antenna and a component layer, where the antenna and the component layer are located on a same side of the underlying substrate, where the component layer and the antenna are disposed at intervals, where the component layer includes a plurality of metal laminates and a plurality of dielectric laminates that are stacked, and where the plurality of metal laminates and the plurality of dielectric laminates are alternately disposed to form a plurality of thin film transistors.