公开(公告)号：US20240170439A1

公开(公告)日：2024-05-23

申请号：US18429432

申请日：2024-02-01

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Fengqun Lang ,  Yutao Wang ,  Huibin Chen

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/373

CPC classification number: H01L24/32 ,  H01L23/367 ,  H01L23/3736 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29299 ,  H01L2224/32151 ,  H01L2224/8384 ,  H01L2924/13055 ,  H01L2924/35

Abstract: A power module includes a first metal layer-clad substrate and a second metal layer-clad substrate that are disposed opposite to each other, and a chip and an interconnection pillar that are located between the first metal layer-clad substrate and the second metal layer-clad substrate. The chip and the first metal layer-clad substrate are electrically connected through press sintering by using a sintering material to improve bonding reliability. The chip is electrically connected to the second metal layer-clad substrate by using the interconnection pillar.