公开(公告)号：US11367700B2

公开(公告)日：2022-06-21

申请号：US16958565

申请日：2017-12-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hongbin Shi ,  Zhuqiu Wang ,  Runqing Ye ,  Haohui Long

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065

Abstract: A device comprising a connecting plate and a circuit element is disclosed. The circuit element is electrically coupled to the connecting plate through a solder connection including a plurality of solder balls disposed between the circuit element and the connecting plate. An underfill layer is formed between the circuit element and the connecting plate and configured to provide bonding between the circuit element and the connecting plate. The solder connection includes a first solder area with a first solder ball density and a second solder area with a second solder ball density. The first solder ball density is less than the second solder ball density. The underfill layer includes a bonding material continuously disposed in the second solder area of the solder connection.