公开(公告)号：US10996265B2

公开(公告)日：2021-05-04

申请号：US16095858

申请日：2016-10-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hui Si ,  Haohui Long ,  Jianping Fang ,  Runqing Ye ,  Weiqiang Hong ,  Yunfei Wang ,  Taixiang Liu

IPC: G01R31/28 ,  H01L21/66

Abstract: A crack detection system and an apparatus equipped with a crack detection circuit, including a main body, and a detection control circuit and a detection coil disposed on the main body. The main body includes a top surface, a bottom surface, and a side surface coupled between the top surface and the bottom surface. The detection coil is distributed on an edge of the main body and disposed surrounding the side surface. Two ends of the detection coil are electrically coupled to the detection control circuit to form a closed-loop detection circuit. The detection circuit is configured to detect a crack in an edge region of the main body. The detection coil includes a plurality of detection sections sequentially coupled from head-to-tail, and adjacent detection sections are not collinear.

公开(公告)号：US20220386015A1

公开(公告)日：2022-12-01

申请号：US17773710

申请日：2020-10-14

Applicant: Huawei Technologies Co., Ltd.

Inventor： Deliang Li ,  Shaojian Chen ,  Xueping Guo ,  Dongyi Zhu ,  Fuqiang Ma ,  Hongbing Shi ,  Runqing Ye

IPC: H04R1/10

Abstract: The wireless headset includes a main control module. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and a plurality of chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion that are connected to the rigid board portion. The rigid board portion is located in the earbud portion. The first flexible board portion is located in the earbud portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end thereof extends to the ear handle portion. A plurality of layers of components are stacked on the rigid board portion of the wireless headset, so that component integration degree is high.

公开(公告)号：US11955080B2

公开(公告)日：2024-04-09

申请号：US18007259

申请日：2021-07-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Haohui Long ,  Xuan Cao ,  Runqing Ye ,  Jianping Fang ,  Xiaochen Chen

IPC: G09G3/3233 ,  G06V40/13 ,  G09G3/00 ,  H10K59/129

CPC classification number: G09G3/3233 ,  G06V40/1318 ,  G09G3/035 ,  H10K59/129 ,  G09G2300/0408 ,  G09G2300/0452 ,  G09G2330/02 ,  G09G2354/00

Abstract: A display module includes a circuit board, an integrated chip, and a pixel chipset. The integrated chip is electrically connected to the circuit board, and the integrated chip includes a first chiplet and a plurality of display pixel drive circuits integrated into the first chiplet. The pixel chipset includes a plurality of light-emitting chips. In addition, at least one pixel chipset is disposed on a surface of a side that is of an integrated chip and that is away from the circuit board, a light-emitting chip disposed on the integrated chip is electrically connected to a display pixel drive circuit in the integrated chip, and the display pixel drive circuit is configured to drive the light-emitting chip to emit light.

公开(公告)号：US11011477B2

公开(公告)日：2021-05-18

申请号：US16339195

申请日：2017-03-30

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hongbin Shi ,  Runqing Ye ,  Haohui Long

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/488 ,  H01L25/00 ,  B32B27/38

Abstract: A high-reliability electronic packaging structure includes a plurality of packaging layers and mechanical support layers. An electrically functional solder joint is provided in a first area of each of the packaging layers, and any two adjacent packaging layers are coupled using electrically functional solder joints. A mechanical support layer is disposed in a second area of each of the packaging layers, and the mechanical support layer is configured to support the two adjacent packaging layers. The first area is provided on a periphery of the second area. Hence, a problem that an internal silicon chip at an upper packaging layer or a lower packaging layer fractures and fails when the upper packaging layer or the lower packaging layer is subject to a mechanical load can be resolved.

公开(公告)号：US11367700B2

公开(公告)日：2022-06-21

申请号：US16958565

申请日：2017-12-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hongbin Shi ,  Zhuqiu Wang ,  Runqing Ye ,  Haohui Long

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L25/065

Abstract: A device comprising a connecting plate and a circuit element is disclosed. The circuit element is electrically coupled to the connecting plate through a solder connection including a plurality of solder balls disposed between the circuit element and the connecting plate. An underfill layer is formed between the circuit element and the connecting plate and configured to provide bonding between the circuit element and the connecting plate. The solder connection includes a first solder area with a first solder ball density and a second solder area with a second solder ball density. The first solder ball density is less than the second solder ball density. The underfill layer includes a bonding material continuously disposed in the second solder area of the solder connection.

公开(公告)号：US10761133B2

公开(公告)日：2020-09-01

申请号：US16095858

申请日：2016-10-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hui Si ,  Haohui Long ,  Jianping Fang ,  Runqing Ye ,  Weiqiang Hong ,  Yunfei Wang ,  Taixiang Liu

IPC: G01R31/28 ,  H01L21/66

Abstract: A crack detection system and an apparatus equipped with a crack detection circuit, including a main body, and a detection control circuit and a detection coil disposed on the main body. The main body includes a top surface, a bottom surface, and a side surface coupled between the top surface and the bottom surface. The detection coil is distributed on an edge of the main body and disposed surrounding the side surface. Two ends of the detection coil are electrically coupled to the detection control circuit to form a closed-loop detection circuit. The detection circuit is configured to detect a crack in an edge region of the main body. The detection coil includes a plurality of detection sections sequentially coupled from head-to-tail, and adjacent detection sections are not collinear.

公开(公告)号：US20190311996A1

公开(公告)日：2019-10-10

申请号：US16339195

申请日：2017-03-30

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hongbin Shi ,  Runqing Ye ,  Haohui Long

IPC: H01L23/00 ,  H01L23/498

Abstract: A high-reliability electronic packaging structure includes a plurality of packaging layers and mechanical support layers. An electrically functional solder joint is provided in a first area of each of the packaging layers, and any two adjacent packaging layers are coupled using electrically functional solder joints. A mechanical support layer is disposed in a second area of each of the packaging layers, and the mechanical support layer is configured to support the two adjacent packaging layers. The first area is provided on a periphery of the second area. Hence, a problem that an internal silicon chip at an upper packaging layer or a lower packaging layer fractures and fails when the upper packaging layer or the lower packaging layer is subject to a mechanical load can be resolved.

公开(公告)号：US12170868B2

公开(公告)日：2024-12-17

申请号：US17773710

申请日：2020-10-14

Applicant: Huawei Technologies Co., Ltd.

Inventor： Deliang Li ,  Shaojian Chen ,  Xueping Guo ,  Dongyi Zhu ,  Fuqiang Ma ,  Hongbing Shi ,  Runqing Ye

IPC: H04R1/10

Abstract: The wireless headset includes a main control module. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and a plurality of chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion that are connected to the rigid board portion. The rigid board portion is located in the earbud portion. The first flexible board portion is located in the earbud portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end thereof extends to the ear handle portion. A plurality of layers of components are stacked on the rigid board portion of the wireless headset, so that component integration degree is high.

公开(公告)号：US20230267883A1

公开(公告)日：2023-08-24

申请号：US18007259

申请日：2021-07-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Haohui Long ,  Xuan Cao ,  Runqing Ye ,  Jianping Fang ,  Xiaochen Chen

IPC: G09G3/3233 ,  G09G3/00 ,  G06V40/13

CPC classification number: G09G3/3233 ,  G09G3/035 ,  G06V40/1318 ,  G09G2354/00 ,  G09G2300/0452 ,  G09G2300/0408 ,  G09G2330/02

Abstract: A display module includes a circuit board, an integrated chip, and a pixel chipset. The integrated chip is electrically connected to the circuit board, and the integrated chip includes a first chiplet and a plurality of display pixel drive circuits integrated into the first chiplet. The pixel chipset includes a plurality of light-emitting chips. In addition, at least one pixel chipset is disposed on a surface of a side that is of an integrated chip and that is away from the circuit board, a light-emitting chip disposed on the integrated chip is electrically connected to a display pixel drive circuit in the integrated chip, and the display pixel drive circuit is configured to drive the light-emitting chip to emit light.

公开(公告)号：US20190324080A1

公开(公告)日：2019-10-24

申请号：US16095858

申请日：2016-10-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hui Si ,  Haohui Long ,  Jianping Fang ,  Runqing Ye ,  Weiqiang Hong ,  Yunfei Wang ,  Taixiang Liu

IPC: G01R31/28 ,  H01L21/66

Abstract: A crack detection system and an apparatus equipped with a crack detection circuit, including a main body, and a detection control circuit and a detection coil disposed on the main body. The main body includes a top surface, a bottom surface, and a side surface coupled between the top surface and the bottom surface. The detection coil is distributed on an edge of the main body and disposed surrounding the side surface. Two ends of the detection coil are electrically coupled to the detection control circuit to form a closed-loop detection circuit. The detection circuit is configured to detect a crack in an edge region of the main body. The detection coil includes a plurality of detection sections sequentially coupled from head-to-tail, and adjacent detection sections are not collinear.