Gas distribution showerhead for semiconductor processing
    1.
    发明申请
    Gas distribution showerhead for semiconductor processing 有权
    用于半导体加工的气体分配喷头

    公开(公告)号:US20050173569A1

    公开(公告)日:2005-08-11

    申请号:US10772787

    申请日:2004-02-05

    CPC分类号: C23C16/45565

    摘要: We have developed a gas distribution showerhead assembly, for use in a semiconductor processing chamber, which can be easily cleaned, with minimal chamber downtime. The gas distribution showerhead assembly includes an electrode having openings therethrough, and a gas distribution plate which includes a plurality of through-holes for delivering processing gases into the semiconductor processing chamber. The gas distribution plate is bonded to a first, lower major surface of the electrode. A removable insert which fits into an opening in the electrode through which gas flows. Spacing between surfaces of the removable insert and surfaces of the electrode is adequate to permit gas flow, but inadequate for plasma ignition within the opening. The removable insert can be easily removed during cleaning of the gas distribution showerhead, permitting the holes in the gas distribution plate to be easily accessed from both sides of the gas distribution plate.

    摘要翻译: 我们开发了一种用于半导体处理室的气体分配喷头组件,可以轻松清洁,并具有最小的室停机时间。 气体分配喷头组件包括具有开口的电极,以及气体分配板,其包括用于将处理气体输送到半导体处理室中的多个通孔。 气体分配板结合到电极的第一下表面。 可拆卸的插入件,其装配在气体流过的电极的开口中。 可拆卸插入件的表面与电极表面之间的间距足以允许气体流动,但不足以在开口内等离子体点火。 在清洁气体分配喷头时可以容易地移除可移除的插入物,从而容易从气体分配板的两侧接近气体分配板中的孔。