公开(公告)号：US20220227062A1

公开(公告)日：2022-07-21

申请号：US17713709

申请日：2022-04-05

Applicant: Hamilton Sundstrand Corporation

Inventor： Joseph V. Mantese ,  Abhijit Chakraborty

IPC: B29C64/393 ,  B29C64/264 ,  G01L1/25 ,  G01N23/20008

Abstract: A material deposition process including in situ sensor analysis of a component in a formation state is provided. The material deposition process is implemented in part by a sensor device of an additive manufacturing machine producing the component. The material deposition process includes sensing, by the sensing device, in situ physical properties of an area of interest of the component during a three-dimensional object production. Compliance to specifications or defects are then detected in the in situ physical properties with respect to pre-specified material requirements. The defects are analyzed to determine corrective actions, and an updated three-dimensional object production, which includes the corrective actions, is implemented to complete the component.

公开(公告)号：US11292198B2

公开(公告)日：2022-04-05

申请号：US16166931

申请日：2018-10-22

Applicant: Hamilton Sundstrand Corporation

Inventor： Joseph V. Mantese ,  Abhijit Chakraborty

IPC: B29C64/393 ,  B29C64/264 ,  G01L1/25 ,  G01N23/20008 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y50/02 ,  B33Y70/00

Abstract: A material deposition process including in situ sensor analysis of a component in a formation state is provided. The material deposition process is implemented in part by a sensor device of an additive manufacturing machine producing the component. The material deposition process includes sensing, by the sensing device, in situ physical properties of an area of interest of the component during a three-dimensional object production. Compliance to specifications or defects are then detected in the in situ physical properties with respect to pre-specified material requirements. The defects are analyzed to determine corrective actions, and an updated three-dimensional object production, which includes the corrective actions, is implemented to complete the component.

公开(公告)号：US11097487B2

公开(公告)日：2021-08-24

申请号：US16230354

申请日：2018-12-21

Applicant: Hamilton Sundstrand Corporation

Inventor： Tahany Ibrahim El-Wardany ,  Joseph V. Mantese ,  Abhijit Chakraborty ,  Paul Attridge

IPC: B29C64/153 ,  G06F30/00 ,  B33Y30/00 ,  B29C64/393 ,  B29C64/371 ,  B22F10/20 ,  B22F10/30 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y50/02 ,  B33Y70/00

Abstract: An additive manufacturing system includes an additive manufacturing (AM) device, a first sensor device, and a compute device. The AM device is configured to form a bulk component in a layer-by-layer manner, by at least iteratively depositing a first layer of raw material onto a working surface in a deposition chamber, consolidating the initial layer into an initial additive portion of the bulk component, then forming subsequent additive portions of the bulk component by depositing and consolidating a subsequent plurality of layers of the raw material onto the first additive portion. The first sensor device is configured to measure an actual composition of at least one first byproduct portion formed upon consolidation of one of the first or subsequent layers of raw material in the deposition chamber. The compute device includes a processor and a memory, and is communicatively coupled to the additive manufacturing device and first sensor device. The additive manufacturing device and compute device provide an in situ sensor analysis of the component while in a formation state during a build process by comparing an actual composition of the at least one first byproduct portion to an expected composition range stored in the memory.