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公开(公告)号：US12235053B2
公开(公告)日：2025-02-25
申请号：US17800647
申请日：2021-02-19
Applicant: Hanon Systems
Inventor： Ji Hun Han , Byung Seon Cho
Abstract: The present invention relates to a heat exchanger having a header structure for dispersing thermal stress. The purpose of the present invention is to provide a heat exchanger having a header structure for dispersing thermal stress, wherein the heat exchanger improves the structure of a tube insertion hole on a header so as to disperse as much thermal stress as possible, by focusing on the fact that thermal stress concentration mainly occurs in a tube nose.
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